Tin solder balls with lead 0,45mm 250.000 pcs for BGA soldering

The tin solder balls with lead 0,45mm 250.000 units are a product designed for electronics professionals and hobbyists who require precision and quality in their BGA soldering and reballing processes.

Main features:

• Composition: 63% tin (Sn) and 37% lead (Pb), a classic alloy for soldering with optimal melting and adhesion properties.
• Ball size: 0,45 mm, ideal for precision work on small electronic components.
• Quantity: 250.000 units per container, providing an abundant supply for multiple applications.
• Manufacturer: Profound Material Technology (PMTC), recognized for its quality and reliability in soldering materials.
• Origin: Taiwan, ensuring international manufacturing standards.

Typical uses:

• Reballing of BGA (Ball Grid Array) chips, allowing repair and maintenance of electronic boards.
• Soldering of small electronic components that require precision and uniform tin application.
• Professional electronics projects that demand high-quality materials to ensure durable and reliable connections.

Compatibility: This product is compatible with soldering stations and specialized tools for reballing and electronic soldering.

Availability: This product is currently out of stock. We recommend checking alternatives or contacting our customer service for future restocks.

The tin solder balls with lead 0,45mm container is a reliable solution for those working in electronic repair and manufacturing, offering soldering material with excellent quality and performance.

• 63Sn 37Pb composition for professional soldering
• 0,45 mm tin balls for precision in BGA reballing
• 250.000 units per container for long-term use
• Made by Profound Material Technology (PMTC) in Taiwan
• Ideal for soldering stations and reballing tools